Technology application
For many years, we have been focusing on OLED MASK evaporation masks and have developed multi-stage etching mechanical equipment and alignment technology to meet various design requirements.
Processing Capability
● Etching products for various types of plate thicknesses
|
Mask Regular item |
Thickness(mm) |
Critical Dimension Tolerance(CD) | Total Pitch Tolerance(TP) | Design Limits | |||
| General | High Precision | General | High Precision | Min Hole/Slot | Min Rib Width | ||
| 0.03~0.05 | ±0.03mm | ±0.005mm | ±0.03mm | ±0.005mm | 0.03~0.05 | 100%*T | |
| 0.06~0.15 | ±0.03mm | ±0.015mm | ±0.03mm | ±0.015mm | 100%*T | 100%*T | |
| 0.20 | ±0.03mm |
Discuss base on drawing |
±0.03mm |
Discuss base on drawing |
100%*T | 100%*T | |
| 0.30 | ±0.03mm | ±0.03mm | 100%*T | 100%*T | |||
| 0.40 | ±10%*T | ±0.03mm | 100%*T | 100%*T | |||
| 0.50 | ±10%*T | ±0.03mm | 100%*T | 100%*T | |||
| 0.60~1.00 | ±10%*T | ±0.03mm | 100%*T | 100%*T | |||
| Structure |
Thickness (mm) |
Min land area (A) | Min space(B) | Half-etch depth(C) | |||
| General Design | General Tolerance | General Design | General Tolerance | General Design | General Tolerance | ||
| 0.20 | >0.30mm | >0.30mm | T*0.75 | ±0.03mm | ≥0.12 | ±0.03 | |
| 0.25 | >0.30mm | >0.30mm | T*0.75 | ±0.03mm | ≥0.15 | ±0.03 | |
| 0.50 | >0.30mm | ±10%*T | T*0.75 | ±10%*T | ≥0.33 | ±0.03 | |
| Cavity |
Thickness (mm) |
Critical Dimension Tolerance(CD) | Half-etch depth | ||||
| General | High Precision | <0.25mm | 0.25~0.4mm | 0.40~0.55mm | 0.55mm以上 | ||
| 0.5mm | ±10%*T | Discuss base on drawing | ±0.015mm | ±0.02mm | ±0.03mm | Discuss base on drawing | |
| 0.7 | ±10%*T | ||||||
| 1.0 | ±10%*T | ||||||
● Depth of semi-etch corresponds to width design
| Half etch drop | Depth | Width |
|
Single step |
10um | ≥250um |
| 20um | ≥400um | |
| 30um | ≥550um | |
| 40um | ≥700um | |
| Double steps | Discuss base on drawing | |
● OLED MASKSection structure and specifications
1、Masks for vaporization are introduced into an open-end, half-etched design to meet the requirements of a normal vaporization angle of TA=45±5 degrees. A secondary exposure process is required to achieve alignment accuracy of ±50um
2、General Design Specifications:
Step width <5um
Step height ≤15um
Taper angle 30~70°,Adjustable according to drawing requirements。
Half depth Regular Type10~40um.Special needs can be evaluated on a case-by-case basis。
Half width is proportional to depth. Refer to Table 1 for design principles, special needs can be evaluated separately.
3、Steam-plated OPEN MASK
Why Choose Huazhou Precision Etching Equipment?
Dongguan Huazhou Machinery Technology Co., Ltd. offers a range of metal etching equipment specifically engineered for manufacturers of demanding precision components.![]()

High-Uniformity Spray System:
Utilizes a fan-shaped nozzle matrix coupled with an oscillating mechanism, achieving overall etching uniformity up to ±3%. This ensures consistent precision between the center and edges of large-format metal masks or vapor chamber plates.
Intelligent Temperature Control & Chemistry Management:
Real-time monitoring and automatic replenishment of etchant, with temperature control accuracy of ±0.5°C, guarantees process stability during long-term, continuous production.
Customized Solutions:
For different products such as high-precision metal masks, vapor chambers, and encoder scale discs, we provide a complete process solution including etching, cleaning, and stripping lines.
Application Cases:
From OLED Screens to Industrial Encoders
High-Precision Metal Mask Etching Equipment:
Serves OLED evaporation mask manufacturers, stably producing precision masks with a thickness of 0.03–0.15mm and maintaining opening dimensional tolerances within ±0.005mm.
Vapor Chamber Precision Etching Equipment:
Processes 0.3–0.8mm ultra-thin vapor chamber tops and bottoms for thermal module manufacturers, achieving micro-channel structures with a minimum line width of 0.25mm and uniform undercut control.
Encoder Scale Disc Precision Etching Equipment:
Produces high-precision metal encoder discs, ensuring slot width and pitch tolerances ≤ ±0.015mm to enhance encoder signal stability.
Conclusion
Precision etching technology is advancing toward finer, thicker, and more complex 3D structures. Whether it is the stepped structure of OLED masks, the micro-channels of vapor chambers, or the ultra-fine slits of encoder discs, the foundation lies in the accuracy, stability, and process control capability of the etching equipment.
Based on precision etching equipment R&D and benchmarking international first-tier process standards, Dongguan Huazhou Machinery Technology Co., Ltd. is committed to providing high-precision, high-reliability etching production lines for high-end manufacturers in China and around the world.
Contact the Huazhou technical team today to obtain a precision etching equipment solution tailored to your product and a free process test.
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